Job Description

Join to apply for the Senior Director, Package Engineering role at PsiQuantum

PsiQuantums mission is to build the first useful quantum computersmachines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy millionqubit, faulttolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries.

Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industryincluding partners like GlobalFoundrieswe use the same highvolume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons dont feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiberoptic infrastructure.

In 2024, PsiQuantum announced governmentfunded projects to support the buildout of our first utilityscale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically definingand that now is the time to scale.

PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companiesincluding Lockheed Martin, MercedesBenz, Boehringer Ingelheim, and Mitsubishi Chemicalto prepare quantum solutions for realworld impact.

Come join us.

Job Summary

The Senior Director of Packaging Engineering will manage a team of optomechanical package design engineers and be responsible for subassembly and BOX designs with quality for R&D and volume system integration and deployment at PsiQ QC (quantum computer) sites. This role requires strong engineering disciplines in thermal, mechanical and optical designs and associated quality standard, a strong can do attitude in a fastpaced environment, problemsolving, and excellent communication with teams across multiple disciplines.

Responsibilities

• Design subassemblies and boxes for QC subsystems with electronics and silicon photonics chips for both cryogenic and room temperature environment in vacuum systems.
• Establish and maintain design flow, conduct design reviews with necessary mechanical, thermal, structural, stress analysis from simulation and measurement to meet design target and requirement by subsystem team.
• Work with crossfunctional team and suppliers on DFM, FMEA to finalize design, and support process team to finalize assembly process flow; release design document in the system with change controls.
• Work with supply chain and suppliers to deliver and verify firstarticle piece parts and provide reports vs. design.
• Support process team of the initial subassembly build and related verification per FMEA and DFM; and follow on piece part quality control.
• Manage budget, capex, hiring per AOP including associated CAD tool licenses and machines.
• Projectmanaging and deliverable, execution milestone, schedule tracking for internal and external suppliers.

Experience / Qualifications

• Experience working within small startup and/or large companies managing optomechanical packaging teams with proven track record to bring product in volume (e.g., in datacom, telecom optical communication industry).
• Experienced with optical and photonics systems; cryogenic system experience is a plus.
• Familiar with key optomechanical packaging supplier base and the quality system.
• Demonstrated ability to manage short deadlines, and to follow a disciplined work process.
• Able to work in a fastpaced environment.
• Ability to build relationships with multiple groups with strong interpersonal, communication skills to be able to work with all levels of the organization from the founders of the company to techs.
• A leadbyexample person, lead from the front attitude when all handsondeck situations arise, get involved in daytoday tasks to assure peak performance and safe work environment for everyone.
• Masters degree or higher in an applicable engineering discipline, such as Mechanical Engineering, Optical Engineering, or Applied Physics.
• 15+ years of experience applying engineering principles to solve complex thermal, mechanical and optical problems.
• Proficient in 2D & 3D packaging tools (Solidworks), thermal, structure and stress simulation (Ansys) and measurement tools with handson experience.
• Experience in design, analysis and assembly of subsystems, NPI and manufacture support including supplier management.
• Excellent written and verbal communication skills; selfstarter.
• Demonstrated strong analytical and problemsolving skills.
• Ability to provide technical leadership in ambiguous situations.
• Strong management skills.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to recruiting@psiquantum.com .

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